H. Harija | Associated Electronics | Best Researcher Award

Dr. H. Harija | Associated Electronics | Best Researcher Award

Dresden University of Technology | Germany

Dr. H. Harija. is a recent Ph.D. graduate in Electrical and Chemical Engineering with extensive expertise in the design and development of advanced sensor technologies. Currently a Research Associate at TU Dresden’s MultiMOD research group, she focuses on sustainable materials-based multimodal sensors, including innovative force sensors using graphene-like materials derived from cork substrates, emphasizing cost-effective production without compromising performance. During her doctoral studies at the Indian Institute of Technology Madras, she specialized in cantilever-based flow sensors with integrated non-intrusive measurement techniques, achieving high accuracy through optical, capacitive, and inductive sensing approaches, while also developing algorithms for real-time monitoring and system integration. Her work spans experimental design, physical modeling, simulation, electro-mechanical and optical characterization, and data analysis, with several high-impact publications and multiple patent applications for low-cost, non-intrusive flow sensing technologies. Dr. Harija’s interdisciplinary training combines electrical and chemical engineering principles with hands-on laboratory skills and proficiency in MATLAB, Ansys, COMSOL Multiphysics, LTspice, ThingSpeak, and Python, enabling seamless integration of hardware and software solutions for miniaturized sensing applications. She has received awards for outstanding presentations, best papers, and research fellowships, reflecting her leadership and innovation in sensor development. With a proven track record of collaborative research, technological innovation, and sustainable engineering solutions, Dr. Harija H. continues to advance the field of instrumentation and smart sensing systems, making significant contributions to both academic research and practical applications in next-generation sensor technologies.

Profile: Google Scholar | Orcid

Featured Publications

Harija, H., George, B., & Tangirala, A. K. (2021). A cantilever-based flow sensor for domestic and agricultural water supply system. IEEE Sensors Journal, 21(23), 27147–27156.

Naveen, H., Narasimhan, S., George, B., & Tangirala, A. K. (2020). Design and development of a low-cost cantilever-based flow sensor. IFAC-PapersOnLine, 53(1), 111–116.

Nag, A., Chakraborthy, A., Vega, M. R. O., Nuthalapati, S., Harija, H., Özer, M. S., … (2023). Ultralow-cost graphene/fabric-based sensors: Characterization and preliminary results. IEEE Sensors Journal, 23(23), 28640–28648.

Harija, H., Langer, E., Prokopchuk, A., Saran, B., Arief, I., Nag, A., … (2024). A piezoresistive cork-based sustainable and robust sensor for force-sensing application. IEEE Sensors Journal, 24(20), 31867–31874.

Harija, H., Charan, K. S. H., George, B., & Tangirala, A. K. (2022). A capacitive cantilever-based flow sensor. International Conference on Sensing Technology, 344–351.

Harija, H., George, B., & Tangirala, A. K. (2024). An inductive sensing mechanism for cantilever based water flow measurement. IEEE Transactions on Instrumentation and Measurement.

Chakraborthy, A., Harija, H., Nuthalapati, S., Langer, E., Nag, A., & Altinsoy, M. E. (2023). Low-cost paper-based sensors for strain-induced applications. In 2023 16th International Conference on Sensing Technology (ICST), 1–6.

Harija, H., Chakraborthy, A., Nuthalapati, S., Langer, E., Nag, A., Richter, A., … (2023). Novel cork-based laser-induced graphene sensors: Proof-of-concept and initial results. In 2023 16th International Conference on Sensing Technology (ICST), 1–6.

Prof. Dr. Panbong Ha | Electronic | Best Researcher Award

Prof. Dr. Panbong Ha | Electronic | Best Researcher Award

Prof. Dr. Panbong Ha | Electronic | Best Researcher Award

🎓 Panbong Ha is an esteemed Emeritus Professor in the Department of Electronic Engineering at Changwon National University (2023–present). With a career spanning over three decades (1987–2023), he served as a professor in the same department. 🌏 During 1998–1999, he was a Visiting Scholar at Lancaster University’s Communication Research Centre. 🧑‍🔬 He holds a Ph.D. and an MS in Electronic Engineering from Seoul National University. His research expertise spans electronic circuits, memory devices, and hybrid bonding technologies. 🛠️ Recently, his innovative contributions include the design of synaptic driving circuits for memory hardware and error correction-based intellectual property. 📚

Professional Profile:

Orcid

Suitability for Best Researcher Award: Panbong Ha

Panbong Ha exemplifies the qualities of an exceptional researcher with a prolific academic and professional career spanning over 35 years. His groundbreaking contributions to electronic engineering, particularly in the fields of memory devices, circuit design, and hybrid bonding technologies, underscore his significance as a thought leader in his field. As a professor at Changwon National University, Panbong Ha not only advanced his research but also nurtured a generation of engineers and researchers. His innovative designs, such as synaptic driving circuits for memory hardware and error correction-based intellectual property, are paving the way for energy-efficient and intelligent electronic systems.

Education and Experience 

  • 🎓 Ph.D. in Electronic Engineering (1985–1995): Seoul National University
  • 🎓 MS in Electronic Engineering (1981–1993): Seoul National University
  • 🧑‍🔬 Researcher (1983–1985): ETRI (Electronics and Telecommunications Research Institute)
  • 👨‍🏫 Professor (1987–2023): Dept. of Electronic Engineering, Changwon National University
  • 🌏 Visiting Scholar (1998–1999): Communication Research Centre, Lancaster University
  • 🎓 Emeritus Professor (2023–present): Dept. of Electronic Engineering, Changwon National University

Professional Development

📈 Panbong Ha has significantly advanced the field of electronic engineering through decades of teaching and research. 🧠 As a professor at Changwon National University (1987–2023), he nurtured innovation and mentored future engineers. 🌏 His tenure as a Visiting Scholar at Lancaster University enriched his knowledge in communication technologies. 🔧 His professional growth reflects his commitment to cutting-edge research, contributing groundbreaking advancements in error correction codes and synaptic driving circuits. 🎯 Through his leadership and expertise, Panbong Ha has remained a driving force in the development of electronic systems, fostering global collaboration and pushing the boundaries of technology. 🌐

Research Focus

🛠️ Panbong Ha’s research focuses on advanced electronic engineering, emphasizing memory devices and circuit design. 🎯 His recent work includes developing multi-time programmable intellectual property with built-in error correction code functions and designing synaptic driving circuits for TFT eFlash-based processing-in-memory hardware. 🧠 These innovations utilize hybrid bonding and advanced semiconductor processes like Bipolar–CMOS–DMOS. 🔍 His research contributes to the evolution of error-resistant electronics and energy-efficient memory systems. 💡 By addressing the challenges of modern electronic design, his work accelerates the development of smarter, more efficient technologies, influencing fields such as AI hardware and integrated memory processing systems. 🚀

Awards and Honors

  • 🏆 Emeritus Professorship (2023): Changwon National University
  • 🌍 Visiting Scholar Recognition (1998–1999): Lancaster University
  • 🎖️ Decades of Excellence Award: Changwon National University (1987–2023)
  • 🛠️ Innovation in Research Award: For advancements in memory circuits and error correction technologies
  • 📜 Recognition for Academic Excellence: Seoul National University during MS and Ph.D. studies

Publication Top Notes:

Design of Multi-Time Programmable Intellectual Property with Built-In Error Correction Code Function Based on Bipolar–CMOS–DMOS Process

Design of Synaptic Driving Circuit for TFT eFlash-Based Processing-In-Memory Hardware Using Hybrid Bonding